3D Metal Powder IMT CuCrZr 15-53 Microns 5 kg

Achieve superior thermal management and exceptional structural integrity in your Additive Manufacturing projects with the IMT CuCrZr 3D Metal Powder 15-53 µm 5 kg. Designed specifically for Laser Powder Bed Fusion (LPBF) systems, this copper-chromium-zirconium alloy resolves the traditional trade-off between conductivity and mechanical strength. It is the reference material for engineers developing high-performance heat exchangers, induction coils, and aerospace components that demand rapid heat dissipation.

Optimised for Process Stability

Success in metal 3D printing starts with powder rheology. This IMT powder features a precise particle size distribution of 15-53 μm, tailored to ensure consistent layer thickness and optimal laser absorption. With a sphericity of ≥ 90% and a Hall flow rate of ≤ 20 s/50 g, the material guarantees smooth, uniform coating across the entire build plate. This high flowability minimises the risk of porosity and segregation, enabling you to achieve high-density parts with reliable repeatability.

Thermal and Mechanical Performance

Whilst pure copper presents challenges in terms of laser absorption and mechanical softness, CuCrZr offers a robust solution. After heat treatment, parts printed with this powder exhibit a tensile strength of ≥ 350 MPa, making them durable enough for functional prototypes and end-use industrial components. Crucially, this strength does not compromise thermal properties; the material maintains a thermal conductivity of ≥ 300 W/m.k at 100 °C. This combination is vital for the creation of conformal cooling channels in injection moulds, significantly reducing cycle times and improving part quality in plastics manufacturing.

Technical Specifications — IMT CuCrZr 3D Metal Powder 15-53 µm 5 kg

Physical Properties

• Size distribution: 15-53 μm
• Hall flow s/50 g: ≤ 20
• Apparent density g/cm³: ≥ 4.4
• Tap density g/cm³: ≥ 5.2
• Oxygen content ppm: ≤ 500
• Sphericity: ≥ 90%

Mechanical and Thermal Properties (after heat treatment)

• Tensile strength (MPa) at room temperature: ≥ 350
• Yield strength (MPa) at room temperature: ≥ 250
• Elongation (%) at room temperature: ≥ 30
• Thermal conductivity at room temperature: ≥ 280 W/m.k
• Thermal conductivity at 100 °C: ≥ 300 W/m.k
• Conductivity: ≥ 85%

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