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3D Printer Raise3D DF2 Complete Bundle

Discover the Potential of the Raise3D DF2 Complete Package

Professional resin 3D printing ecosystem — Raise3D DF2 Complete Package

If you are an engineer or manufacturer seeking absolute precision and genuine workflow automation, the Raise3D DF2 Complete Package is your solution. This professional Digital Light Processing (DLP) ecosystem integrates high-resolution printing with washing and post-curing stations via RFID technology. With this solution, you eliminate manual configuration errors and accelerate short-run production with unmatched industrial reliability.

Industrial-Grade Optical Precision

Industrial-grade high-precision optical design — Raise3D DF2 Complete Package

At the heart of this machine sits the first industrial-grade DMD chip from Texas Instruments, designed specifically for 3D printing. Unlike the light sources found in consumer-grade equipment, this component delivers sharp pixel images with a frame error margin of ≤ ±0.1 mm, eliminating distortion and preventing surface light field effects.

Advanced contour compensation algorithms — Raise3D DF2 Complete Package

Thanks to its native resolution of 2560 x 1440 and advanced algorithms including Contour Compensation and Anti-Aliasing, you achieve exceptionally smooth surfaces and well-defined edges. It is the indispensable tool for complex prototyping where standard Stereolithography (SLA) printers cannot reach the required level of detail.

To ensure perfect light transmission, the optical path incorporates high-transparency nFEP film and optical glass from Schott Germany. This premium glass minimises light loss and eliminates dispersion, ensuring every cured layer is sharp and faithful to your digital design.

Automated Workflow with RFID

Intelligent build platform with RFID technology — Raise3D DF2 Complete Package

Achieve consistent results with the intelligent build platform featuring RFID technology. The system automatically detects the resin type and transfers data throughout the entire process, communicating seamlessly with the post-processing units included in this package.

Synchronisation of precise processing parameters — Raise3D DF2 Complete Package

Forget human error: the DF Wash and DF Cure stations read the RFID tag to automatically apply the exact processing parameters. This traceable workflow dramatically reduces labour hours and ensures every batch has identical mechanical properties — a critical factor in regulated sectors such as dentistry and medicine.

Mechanical Reliability and Robust Construction

Patented Air-Peel technology for gentle layer separation — Raise3D DF2 Complete Package

To handle complex geometries, the patented Air-Peel technology reduces the layer separation force from the typical 50 kg down to just 10 kg. This enables a far gentler film release, increasing the success rate on fine details and reducing stress on the part.

Industrial Z-axis with static load capacity — Raise3D DF2 Complete Package

Structural integrity is guaranteed by a high-strength Z-axis capable of supporting 200 kg of static load. This solid construction allows you to print models weighing up to 10 kg without vibration or layer shifting, ensuring maximum vertical precision on large, solid parts.

Intelligent Software and Advanced Usability

Intuitive large-format touchscreen interface — Raise3D DF2 Complete Package

The large 10.25-inch touchscreen integrates the Magic Layout interface, allowing you to duplicate prints or adjust the layout directly on the machine. You can make instant changes to your production batch without returning to a computer or slicer software.Automatic resin filling system — Raise3D DF2 Complete Package

Avoid unpleasant surprises with the automatic pre-print inspection system. Before starting, the machine verifies critical conditions — such as resin compatibility, platform installation, and material levels — to prevent costly failures.

Material management is optimised through automatic resin filling and ultrasonic liquid level monitoring. Your contact with uncured resin is kept to a minimum, and the assisted tank cleaning functions ensure clean, safe material changes.Suction cup detection and automatic orientation — Raise3D DF2 Complete Package

The ideaMaker software has been optimised for the DF2 with features such as Suction Cup Detection and Automatic Orientation. These tools analyse cross-sections to reduce separation forces, ensuring reliable results regardless of your experience level.


Technical Specifications of the Raise3D DF2 Ecosystem

1. Raise3D DF2 Printer

Category Parameter Specifications
Printer Hardware Printing Technology Digital Light Processing (DLP)
Build Volume (W × D × H) 200 × 112 × 300 mm
XY Resolution 2560 × 1440
Max. Part Weight 10 kg
Max. Print Speed 80 mm/h (0.2 mm per layer)
Layer Height 50–200 microns
Resin Management Automatic feeding, Level detection, Resin type confirmation
Control Panel Touchscreen (Resolution: 1920 × 720) with Magic Layout
RFID Build Platform Records resin type and settings (washing and post-curing)
Level Calibration Factory calibrated
Chamber Heating Max. 40°C
Resins Raise3D Resins Standard White, High Detail Apricot, Tough 2K Grey, Rigid 3K Grey, High Clear, Draft Grey, High Temp (Coming Soon)
OMP (Open Material Programme) LOCTITE® (IND405, PRO476, 3843, etc.), Ultracur3D® (RG 3280, EL 60, etc.)
Operation & Shipping Power Input 100–240 V AC, 50/60 Hz 230 V @ 3.3 A
Machine Dimensions 450 × 408 × 730 mm
Net Weight 40 kg
Shipping Dimensions 710 × 595 × 980 mm

2. Raise3D DF Wash Washing Station

Category Parameter Specifications
Washing Hardware Tank Volume 14 L
Max. Washing Size 200 × 112 × 300 mm
Compatible Solvent IPA (Isopropyl Alcohol), TPM
Washing Functions Twin-turbo Washing, Manual Washing Simulation
Drying Function Dual-fan air drying
Drainage Automatic liquid drainage with waste container
Washing Profile Automatic adjustment via RFID or manual input
Operation & Shipping Power Input 100–240 V AC, 50/60 Hz, 96 W
Machine Net Weight 27.7 kg
Machine Dimensions 400 × 410 × 646 mm
Waste Container Size 350 × 190 × 290 mm

3. Raise3D DF Cure Post-Curing Station

Category Parameter Specifications
Post-Curing Hardware Max. Curing Size φ 230 × 300 mm
Curing Source LED (mixed 365 nm, 385 nm, 405 nm); Air heating up to 120°C
Curing Profile Automatic adjustment via RFID or manual input
Operation & Shipping Power Input 100–240 V AC, 50/60 Hz, 500 W
Net Weight 32.8 kg
Machine Dimensions 400 × 490 × 610 mm
Shipping Dimensions 725 × 585 × 850 mm


Purchasing from EXPERT3D means peace of mind and professionalism. As official Raise3D partners in Spain, we provide specialist technical support, official warranty, and express 24/48h shipping for your new complete DLP solution.

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