- Stock: In Stock
- Product code: 00-08800236
- Weight Brutto: 1.00kg
Hyper Speed PLA Filament Designed for High-Speed 3D Printing
The Hyper Speed PLA high-speed printing filament is one of the specially engineered filaments in the high-speed materials range for FDM 3D printing on Pro3 series 3D printers.During high-speed 3D printing, filament is fed rapidly into the thermal block, and the polymer must transition from solid to molten state very quickly. This speed can cause nozzle blockages and poor adhesion between layers. Raise3D Hyper Speed PLA features an optimised molecular weight and fine-tuned flow rate. It achieves faster melting in the hotend and significantly quicker cooling after extrusion.
As a result, the surface quality of parts produced with Hyper Speed materials remains smooth, and the majority of fine details are preserved. Crucially, thanks to its optimised molecular weight, HS PLA demonstrates excellent layer bonding quality and strength in the Z direction. HS PLA is therefore well suited for concept models and figures, prototyping, and more.
Key Features of Raise3D Hyper Speed PLA
- Designed for high-speed FDM printing
- High flow rate
- Lower heat capacity
- Easy to print with an excellent surface finish
- Excellent inter-layer adhesion
Applications of Raise3D High-Speed PLA Filament
- Hyper-speed printing
- Prototyping and design
- Education and visualisation
- Art and sculpture
- Manufacturing aids
Recommended Print Parameters for HS PLA
- Nozzle temperature: 200 – 230 °C
- Build plate temperature: 45 – 60 °C
- Layer height: 0.1 – 0.2 mm
- Print speed: 60 – 300 mm/s
- Cooling fan: On
- Drying temperature: 40 °C
Printing Notes for Hyper Speed PLA:
- To improve part quality, the use of a cooling fan is strongly recommended.
- Premium PLA or Hyper Speed PLA itself can be used as a removable support material when printing with HS PLA.
Material Parameters
| Compatible filaments | Premium PVA+, Premium PLA |
| Filament diameter (mm) | 1.75 |
| Density (g/cm³) | 1.21 |
| 3D Printing | |
| Filament drying temperature (°C) | 40 °C |
| Print temperature (°C) | 200 - 230 |
| Build plate adhesion | BuildTak, Blue Tape |
| Layer height (μm) | 100 - 200 |
| Heated build plate | Required |
| Build plate temperature (°C) | 45 - 60 |
| Enclosed chamber | Not required |
| Cooling (%) | On |
| Nozzle diameter (optional) (mm) | 0.2, 0.6, 0.8, 1.0 |
| Nozzle diameter (standard) (mm) | 0.4 |
| Print speed (mm/s) | 50 - 300 |
| Details | |
| Material | Hyper Speed PLA |
| Filament RFID sensor | Yes |
| Printer compatibility | Pro3, Pro3 Plus, Pro3 HS, Pro3 HS Plus, Pro2, Pro2 Plus, RMF500 |
| Country of manufacture | China |
| Weight and dimensions | |
| Material weight (kg) | 1.0 |